of Chinese Stone Machinery
Model | TMV-6000 | |
CPU | CPU | Intel® 6-8/11th Generation Core / Pentium/ Celeron mobile CPU |
TDP | 35W | |
Socket | SoC | |
Chipset | Chipset | Intel® Q170/C236 |
BIOS | BIOS | AMI UEFI BIOS (Support Watchdog Timer) |
Memory | Socket | 1 * Non-ECC SO-DIMM Slot, Dual Channel DDR4 up to 2400MHz |
Max Capacity | 16GB, Single Max. 16GB | |
Graphics | Controller | Intel® HD Graphics |
Ethernet | Controller | 2 * Intel i210-AT/i211-AT;I219-LM LAN Chip ( 10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Chip ( 10/100/1000 Mbps, RJ45; support POE) |
Storage | M.2 | 1 * M.2(Key-M,support 2242/2280 SATA or PCIe x4/x2 NVME SSD)1 * M.2(key-M,support 2242/2280 SATA SSD) |
Expansin Slots | Expansion box | ①6 * COM(30pin Spring-loaded plug-in Phoenix terminals, RS232/422/485 optional (select by BOM),RS422/485 Optoelectronic isolation function optional)+16 * GPIO(36pin Spring-loaded plug-in Phoenix terminals,support 8* Optoelectronic isolation input,8* Optoelectronic isolation output (Optional relay/opto-isolated output)) |
②32 * GPIO(2*36pin Spring-loaded plug-in Phoenix terminals,support 16* Optoelectronic isolation input,16* Optoelectronic isolation output (Optional relay/opto-isolated output)) | ||
③4 * light source channels(RS232 control,Support external triggering, total output power 120W; The single channel supports a maximum of 24V 3A (72W) output, 0-255 stepless dimming, and the external trigger delay <10us)1 * Power input(4pin 5.08 Phoenix terminals with locked) | ||
Notes: Expansion box ①② can be expand one of the two, Expansion box③ can be expanded up to three on one TMV-7000 | ||
M.2 | 1 * M.2(Key-B, support 3042/3052 4G/5G module) | |
Mini PCIe | 1 * Mini PCIe (support WIFI/3G/4G) | |
Front I/O | Ethernet | 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE(10/100/1000Mbps,RJ45,support POE function optional,support IEEE 802.3af/ IEEE 802.3at,single port MAX. to 30W,total P=MAX. to 50W) |
USB | 4 * USB3.0 (Type-A, 5Gbps) | |
Display | 1 *HDMI: max resolution up to 3840*2160 @ 60Hz1 * DP++: max resolution up to 4096*2304 @ 60Hz | |
Audio | 2 * 3.5mm Jack (Line-Out + MIC) | |
Serial | 2 * RS232 (DB9/M) | |
SIM | 2 * Nano SIM card slot (SIM1) | |
Rear I/O | Antenna | 4 * Antenna hole |
Power Supply | Type | DC, |
Power Input Voltage | 9 ~ 36VDC, P≤240W | |
Connector | 1 * 4Pin Connector, P=5.00/5.08 | |
RTC Battery | CR2032 Coin Cell | |
OS Support | Windows | 6/7th:Windows 7/8.1/108/9th: Windows 10/11 |
Linux | Linux | |
Watchdog | Output | System Reset |
Interval | Programmable via Software from 1 to 255 sec | |
Mechanical | Enclosure Material | Radiator: Aluminum alloy, Box: SGCC |
Dimensions | 235mm(L) * 156mm(W) * 66mm(H) without expansion box | |
Weight | Net: 2.3 kgExpansion box Net: 1kg | |
Mounting | DIN rail /Rack mount / Desktop | |
Environment | Heat Dissipation System | Fanless Passive Cooling |
Operating Temperature | -20~60℃ (Industrial SSD) | |
Storage Temperature | -40~80℃ (Industrial SSD) | |
Relative Humidity | 10 to 90% RH (non-condensing) | |
Vibration During Operation | With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis) | |
Shock During Operation | With SSD: IEC 60068-2-27 (30G, half sine, 11ms) |
Model | TMV-7000 | |
CPU | CPU | Intel® 6-9th Generation Core / Pentium/ Celeron Desktop CPU |
TDP | 65W | |
Socket | LGA1151 | |
Chipset | Chipset | Intel® Q170/C236 |
BIOS | BIOS | AMI UEFI BIOS (Support Watchdog Timer) |
Memory | Socket | 2 * Non-ECC SO-DIMM Slot, Dual Channel DDR4 up to 2400MHz |
Max Capacity | 32GB, Single Max. 16GB | |
Ethernet | Controller | 2 * Intel i210-AT/i211-AT;I219-LM LAN Chip ( 10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Chip ( 10/100/1000 Mbps, RJ45; support POE) |
Storage | M.2 | 1 * M.2(Key-M,support 2242/2280 SATA or PCIe x4/x2 NVME SSD)1 * M.2(key-M,support 2242/2280 SATA SSD) |
Expansin Slots | Expansion box | ①6 * COM(30pin Spring-loaded plug-in Phoenix terminals, RS232/422/485 optional (select by BOM),RS422/485 Optoelectronic isolation function optional)+16 * GPIO(36pin Spring-loaded plug-in Phoenix terminals,support 8* Optoelectronic isolation input,8* Optoelectronic isolation output (Optional relay/opto-isolated output)) |
②32 * GPIO(2*36pin Spring-loaded plug-in Phoenix terminals,support 16* Optoelectronic isolation input,16* Optoelectronic isolation output (Optional relay/opto-isolated output)) | ||
③4 * light source channels(RS232 control,Support external triggering, total output power 120W; The single channel supports a maximum of 24V 3A (72W) output, 0-255 stepless dimming, and the external trigger delay <10us)1 * Power input(4pin 5.08 Phoenix terminals with locked) | ||
Notes: Expansion box ①② can be expand one of the two, Expansion box③ can be expanded up to three on one TMV-7000 | ||
M.2 | 1 * M.2(Key-B, support 3042/3052 4G/5G module) | |
Mini PCIe | 1 * Mini PCIe (support WIFI/3G/4G) | |
Front I/O | Ethernet | 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE(10/100/1000Mbps,RJ45,support POE function optional,support IEEE 802.3af/ IEEE 802.3at,single port MAX. to 30W,total P=MAX. to 50W) |
USB | 4 * USB3.0 (Type-A, 5Gbps) | |
Display | 1 *HDMI: max resolution up to 3840*2160 @ 60Hz1 * DP++: max resolution up to 4096*2304 @ 60Hz | |
Audio | 2 * 3.5mm Jack (Line-Out + MIC) | |
Serial | 2 * RS232 (DB9/M) | |
SIM | 2 * Nano SIM card slot (SIM1) | |
Power Supply | Power Input Voltage | 9 ~ 36VDC, P≤240W |
OS Support | Windows | 6/7th:Windows 7/8.1/108/9th: Windows 10/11 |
Linux | Linux | |
Mechanical | Dimensions | 235mm(L) * 156mm(W) * 66mm(H) without expansion box |
Environment | Operating Temperature | -20~60℃ (Industrial SSD) |
Storage Temperature | -40~80℃ (Industrial SSD) | |
Relative Humidity | 10 to 90% RH (non-condensing) | |
Vibration During Operation | With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis) | |
Shock During Operation | With SSD: IEC 60068-2-27 (30G, half sine, 11ms) |
According to your actual needs, choose the most reasonable overall design and planning procedures